Guest Editors: Manh-Huong Phan, Nguyen Xuan Phuc, and Tran Dai Lam, Special Section: 2015 Electronic Materials Conference. Guest Editors: Chih Wah Kok, Wing Shan Tam, Chao Sung Lai, Jer Chyi Wang. All submissions to the Journal of Electronic Materials must be within its scope, and advance scientific knowledge by addressing important questions relevant for the research of electronic materials. July 2015, issue 7. Special Topic on Materials Studies in Energy Systems. Includes materials for memory, logic. IEEE websites place cookies on your device to give you the best user experience. Guest Editors: Manh-Huong Phan, Nguyen Van Hieu, Anh-Tuan Le, Nguyen Phuc Duong, Yogi Shibutani, and Nguyen Hoang Luong, 2016 International Conference on Thermoelectrics. Guest Editors: Anna Mogilatenko, Catherine Bougerol, Matthias Bickermann, Julita Smalc-Koziorowska, Michael Dudley, Special Section: 19th International Conference on II-VI Compounds and Related Materials. JPhys Materials is a new open access journal highlighting the most significant and exciting advances in materials science. © The Minerals, Metals & Materials Society, Not logged in Modern Electronic Materials. Go to … Guest Editors: Kyoung-sik (Jack) Moon, Raymond C. Rumpf, Namsoo P. Kim, and Seung-Kyum Choi, Special Sections from the 2014 TMS Annual Meeting: Pb-free Solders and Materials for Emerging Interconnect and Packaging Technologies; Advanced Materials for Power Electronics and Power Conditioning Systems; and Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XIII. Guest Editors: Erol Kurt, Shadia Ikhmayies, and Ibrahim Sefa, The Third International Conference on Advanced Materials and Nanotechnology (ICAMN 2016) and The International Workshop on Advanced Materials and Nanotechnology (IWAMN 2016). Find out more. Guest Editor: Hiroshi Nishikawa, Special Section: Electronic Materials for Renewable Energy Applications 2018, Special Section: U.S. Workshop on the Physics and Chemistry of II-VI Materials 2018, Special Section: Progress and Challenges for Emerging Integrated Energy Modules, Special Section: 60th Electronic Materials Conference 2018. Pb-free Solders and Materials for Emerging Interconnect and Packaging Technologies. Guest Editors: Jihui Yang, Hiroaki Anno, Matt Beekman, Ryoji Funahashi, Yuri Grin, Emmanuel Guilmeau, Jan Koenig, Bertrand Lenoir, Don Morelli, Lasse Rosendahl, James R. Salvador, Jeff Sharp, David Singh, Tsunehiro Takeuchi, Xiegeng Tang, Chunlei Wang, Hsin Wang, Wenqing Zhang, and Tie-Jun Zhu, 2013 Electronic Materials Conference. Electronic Materials for Energy Including Electrochemical and Photocatalytical Applications, Ferroelectrics, Oxide/Nitride Semiconductor Electronic Devices, and Chalcogenides Dong-Hau Kuo, National Taiwan University of Science and Technology, Taipei, Taiwan OUR LATEST ISSUE : JEM HOME PAGE TABLES OF CONTENTS SPECIAL ISSUES BACKGROUND ON JEM EDITORIAL PLANS & CALLS FOR PAPERS AUTHOR GUIDELINES SUBSCRIPTIONS : JEM Abstracts & Tables of Contents 2006. Guest Editors: Darrel Frear, Rachael Myers-Ward, Paul Ohodnicki, and Chaohong Wang, European Conference on Thermoelectrics 2013. Nowadays, electronic materials are widely used in our daily life. send feedback, Special Section: Progress and Challenges With Stability, Sustainability, Toxicity, and Scalability of Perovskite Materials and Devices. Phase Stability, Phase Transformation and Reactive Phase Formation in Electronic Materials. January 2012, issue 1. EndNote Styles - Journal of Electronic Materials. Special Section: U.S. Workshop on Physics and Chemistry of II-VI Materials 2019, Special Section: 18th Conference on Defects-Recognition, Imaging and Physics in Semiconductors (DRIP XVIII). Specific areas of interest are materials for state-of-the-art transistors, nanotechnology, electronic packaging, detectors, emitters, metallization, superconductivity, and energy applications. Guest Editors: Angel Yanguas-Gil, Ganesh Balakrishnan, Joshua D. Cladwell, Jamie Phillips, Joshua Zide, Michael Tiscler, John Baniecki, Suzanne Mohney, and Shadi Shahedipour-Sandvik, Special Section: 3D Printing. Guest Editors: Oscar Martínez Sacristán, Martina Baeumler, Deren Yang, Ute Zeimer, Jean-Pierre Landesman, Helena Castan Lanaspa, Special Sections: 18th International Conference on II–VI Compounds and Related Materials. Dhar, Special Section: Third European Conference on Renewable Energy Systems. November 2015, issue 11; October 2015, issue 10; September 2015, issue 9; August 2015, issue 8. Practical demands have fueled the development of electronic materials with skin-like properties in terms of stretchability, self-healing capability, and biodegradability. Forum for rapid dissemination of the results of original research in electronic materials. Special Issue: Second Symposium of Renewable Energy and Sustainability: Research of Solar Materials in Mexico. Guest Editors: Min-Wook Oh, Matt Beekman, Ken Kurosaki, Kyu Hyoung Lee, Donald Morelli, Takao Mori, Michitaka Ohtaki, Yanzhong Pei, Jae Sung Son, Tsunehiro Takeuchi, Wenqing Zhang, Li-dong Zhao, Tie-Jun Zhu; Special Section: Progress and Challenges in Developing Electromagnetic Interference Materials. Guest Editors: Joshua Caldwell, Rachel Goldman, Jamie Phillips, Oana Jurchescu, Shadi Shahedipour-Sandvik, Alberto Salleo, Grace Xing, and Jian Xu, Pb-free Solders and Materials for Emerging Interconnect and Packaging Technologies, Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XI, 2011 U.S. Workshop on the Physics and Chemistry of II-VI Materials, International Conference on Thermoelectrics 2011, Phase Stability, Phase Transformation and Reactive Phase Formation in Electronic Materials, 2010 U.S. Workshop on the Physics and Chemistry of II-VI Materials, International Conference on Thermoelectrics 2010, Special Issue: Pb-Free Solders and Emerging Interconnect and Packaging Technologies, Special Issue: Phase Stability, Phase Transformation and Reactive Phase Formation in Electronic Materials, Special Issue: International Conference on Thermoelectrics 2009, 2009 U.S. Workshop on the Physics and Chemistry of II–VI Materials, 2009 International Conference on Defects: Recognition, Imaging and Physics in Semiconductors (DRIP), Special Issue: Group III Nitrides, Silicon Carbide, and Zinc Oxide, 2008 U. 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